goot SF-C7008 Silverless Lead Free Solder, Φ0.03 inch (0.8 mm), For Precision Printed Circuit Boards, Tin Remain/0.7% Copper/0.05% Nickel/0.05% Germanium/Less 0.01% Germanium, 2.4 oz (70 g), No Bobbin

★★★★★ 4.2 138 reviews

US$13.36
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US$13.36
Price when purchased online
Free shipping Free 30-day returns

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Product details

Management number 209981921 Release Date 2026/04/02 List Price US$13.36 Model Number 209981921
Category

Non-toxic Lead Environmentally Friendly Lead Free Solder Silver Less 2.5 oz (70 g) for Substrate Diameter Φ0.8

  • Eco-friendly non-bobbin paper packaging
  • Composition: Tin residue: Copper 0.7%, Nickel 0.05%, Germanium 0.01% or less
  • Melting Point: 227°C
  • Wire diameter: 0.03 in (0.8 mm)
  • Solder Roll: Approx. 2.5 oz (70 g), Approx. 16.4
Brand Name goot
Style Name Φ0.8mm
Item Weight 70 Grams
Manufacturer 太洋電機産業(goot)
Model Number SF-C7008
Power Source No
Item Type Name Solder
Heating Element Silver
Number of Items 1
Additional Features Achieves an even surface luster with less drag nesting, Excellent wetness to form beautiful fillets, Made in Japan
Included Components No
Manufacturer Part Number SF-C7008

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4.2 out of 5
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138 ratings | 57 reviews
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